Bond Testing
A bond test is used to determine the ability of an adhesive to remain in contact with a surface or material while under stress or the adhesive’s ability to hold together two materials as they are stressed. The bond itself is tested after it has been applied and allowed to cure by either applying a force directly to the adhesive in an attempt to remove it from the material or by attempting to separate to materials to have been connected to each other by the adhesive. The force is then either steadily increased or remains constant and is applied to the bond until it fails.
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